JPT183 Low-Melting-Point Solder Paste - 35g Syringe

Product Name

JPT183 Low-Melting-Point Solder Paste – 35g Syringe

Description

JPT183 Solder Paste – 35g

JPT183 solder paste is a low-melting-point solder paste designed for SMD assembly, PCB repair and hot-air rework.

Supplied in a 35g syringe with two different-size dispensing needles, it can be applied accurately to small pads and components before heating with a hot-air station or suitable reflow equipment.

Its paste consistency helps components remain in position during placement, making it particularly useful for fine electronics repair and small surface-mount components.

Suitable For

• SMD component installation
• PCB assembly
• Electronics repair
• Hot-air rework
• Connector replacement
• Small IC installation
• Fine-pitch component work
• General workshop soldering

Key Features

• 183°C nominal melting point
• 35g syringe
• Supplied with two dispensing needle sizes
• Easy controlled application
• Suitable for hot-air and reflow work
• Good viscosity for component placement
• Ideal for PCB and SMD applications

How It Works

Solder paste combines fine solder particles with flux into a paste that can be dispensed directly onto PCB pads.

Components are positioned onto the paste before heat is applied. Once the paste reaches its reflow temperature, the solder melts and forms the electrical and mechanical connection between the component and PCB.

Storage

This solder paste can be stored without refrigeration under suitable conditions, although cooler storage may help extend its usable life.

Always keep the syringe securely sealed when not in use and follow any storage guidance supplied with the product.

Package Contents

• 1 × 35g JPT183 Solder Paste Syringe
• 2 × Dispensing Needles