HM805 Thermal Paste - 6.5W/m·K High-Performance Compound

HM805 Thermal Paste

HM805 Thermal Paste is a high-performance silicone-based thermal compound designed to improve heat transfer between processors, heatsinks and other heat-generating components.

With a rated thermal conductivity of 6.5W/m·K, it is suitable for a wide range of electronics, computer and games console repair applications, including CPUs, GPUs and other components requiring thermal interface material.

We particularly like this compound for Xbox 360 servicing and refurbishment, as it offers good thermal performance while remaining straightforward to apply.

Suitable For

• CPUs and GPUs
• Games consoles
• PCs and laptops
• Graphics cards
• Heatsinks
• Electronics repair and refurbishment
• General thermal management applications

Key Features

• Thermal conductivity: 6.5W/m·K
• Silicone-based compound
• Non-electrically conductive
• Easy to apply
• Wide operating temperature range
• Suitable for CPU and GPU applications
• Ideal for console and computer servicing

Technical Specifications

• Colour: Grey
• Density @ 20°C: 2.3g/ml
• Viscosity @ 1 RPM: 80,000 mPa·s
• Thermal Conductivity: 6.5W/m·K
• Thermal Impedance: 0.0016°C-in²/W
• Weight Loss after 96 Hours @ 100°C: 0.1%
• Permittivity @ 1MHz: 2.0
• Volume Resistivity: 3.0 × 10¹³ Ω·cm
• Dielectric Strength: 2.0kV/mm
• Electrical Conductivity: Non-conductive
• Operating Temperature: -30°C to 280°C
• Base Material: Silicone

Application

Clean the processor and heatsink surfaces thoroughly before applying a small, even amount of thermal compound.

For the best results, remove all traces of the previous thermal interface material before fitting the heatsink.

Please note: Avoid excessive application. Only enough thermal compound to fill microscopic imperfections between the two surfaces is required.